中国科学院重庆绿色智能技术研究院机构知识库

QQ客服 官方微博 反馈留言

	Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
	Liu, Donghua1,2; Chen, Xiaosong1,2; Yan, Yaping3,4,5; Zhang, Zhongwei3,4,5; Jin, Zhepeng1,2; Yi, Kongyang1,2; Zhang, Cong1,2; Zheng, Yujie6; Wang, Yao7,8; Yang, Jun9
	2019-03-13
摘要	Relatively low mobility and thermal conductance create challenges for application of tungsten diselenide (WSe2) in high performance devices. Dielectric interface is of extremely importance for improving carrier transport and heat spreading in a semiconductor device. Here, by near-equilibrium plasma-enhanced chemical vapour deposition, we realize catalyst-free growth of poly-crystalline two-dimensional hexagonal-boron nitride (2D-BN) with domains around 20 similar to 200 nm directly on SiO2/Si, quartz, sapphire, silicon or SiO2/Si with three-dimensional patterns at 300 degrees C. Owing to the atomically-clean van-der-Walls conformal interface and the fact that 2D-BN can better bridge the vibrational spectrum across the interface and protect interfacial heat conduction against substrate roughness, both improved performance and thermal dissipation of WSe2 field-effect transistor are realized with mobility around 56 similar to 121 cm(2 )V(-1 )s(-1) and saturated power intensity up to 4.23 x 10(3) W cm(-2). Owing to its simplicity, conformal growth on three-dimensional surface, compatibility with micro-electronic process, it has potential for application in future two-dimensional electronics.
DOI	10.1038/s41467-019-09016-0
发表期刊	NATURE COMMUNICATIONS
ISSN	2041-1723
卷号	10页码:11
收录类别	SCI
WOS记录号	WOS:000461022600001
语种	英语